| 摘要 |
PURPOSE:To improve quality by preventing void from being generated by making uniform flow speed of a melted resin which is supplied within a cavity without changing a basic dimensional configuration for storing a semiconductor element into a cavity. CONSTITUTION:A cavity K is formed between an upper mold 10 and a lower mold 11, a semiconductor element c is placed on a lead frame a and a die pad b to be sealed with resin and at the same time is stored while being connected via a lead within the cavity, a melted sealing resin material is supplied to the cavity K for sealing the semiconductor element c with resin, and then upper and lower molds are provided with heaters which are means for setting mutually different temperatures. |
