| 摘要 |
PURPOSE:To remove a photoresist by development to a desired thickness by specifying the optical thickness of the photoresist and a transparent film, thereby forming the transparent film. CONSTITUTION:A metal film 2 is formed on a transparent substrate 1 and further, the transparent film 3 is laminated thereon. Hole-like pits 4 and groove-like groove parts 5 are formed in this film. The pit parts 4 consist of only the transparent substrate 1 from which the metal film 2 and the transparent film 3 are removed. The groove parts 5 consist of the transparent substrate 1 from which the transparent film 3 and the metal film 2 are partly removed and the metal film 2 which is decreased in the thickness. The transparent film 3 having nearly the same refractive index as the refractive index of the photoresist is formed on the metal film 2 in such a manner that the optical thickness of the photoresist and the transparent film 3, i.e., the thickness expressed by nd, where the refractive index is (n) and the thickness of the photoresist and the transparent film 3 is (d), attains odd times 1/4 the wavelength of a light beam and, thereafter, the photoresist is formed on the transparent film 3. The thickness of the photoresist after the removal by the development is changed by changing the thickness of the transparent film in such a manner. |
