发明名称 DEVICE FOR WORKING LEAD FRAME
摘要 <p>PURPOSE:To make the cut of a top connecting part and the bending of a hanging lead possible make turning-over needless and to simplify a process by positioning the lead frame between an upper die and a lower die while turning the back surface of the lead frame upward to mount. and lowering the upper die down to the lower die. CONSTITUTION:This working device can simplify a process for removing the top end connecting part of the lead frame provided with the top end connecting part of a lead and a process for bending a hanging lead. An upper die 1 having a hanging lead back surface facing part 12 which bends the hanging lead and provides the step and a top end press-cutting blade 13 cutting the top end connecting part, and a lower die having a hanging lead front surface facing part and a press-cutting blade receiving part corresponding to the hanging lead back surface facing part 12 and the top end press-cutting blade 13 are provided in the working device. The cutting of the top end connecting part and the bending of the lead can be executed with one process. Therefore, turning over of the lead frame is needless, the process is simplified and device required for process can be simplified.</p>
申请公布号 JPH05305362(A) 申请公布日期 1993.11.19
申请号 JP19920111484 申请日期 1992.04.30
申请人 TOPPAN PRINTING CO LTD 发明人 SEGAWA TAKAO
分类号 B21D28/00;B21D35/00;H01L23/50;(IPC1-7):B21D28/00 主分类号 B21D28/00
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