发明名称 MASTER SLICE INTEGRATED CIRCUIT
摘要 PURPOSE:To make the I/O cell width wider than the pad pitch, regarding the arrangement method of I/O cells and pads of a master slice integrated circuit. CONSTITUTION:A pad 52 for power supply is arranged between two pads 51 for signal, and an I/O cell region 4 adjacent to the pads 52 for power supply are equally divided. The region of an I/O cell 3 connected with pads 51 for signal arranged on both sides of the pads 52 for power supply is enlarged. The pads are repeatedly and periodically arranged by turning the arrangement of the pad 51 for signal, the pad 52 for power supply, and the pad 51 for signal into a group. Thereby the pad pitch can be reduced to 2/3 of the conventional pitch, without changing the I/O cell size. Further the power supply pad is always arranged so as to be adjucent to the I/O cell, thereby enabling noise reduction at the time of simultaneous operation.
申请公布号 JPH05308136(A) 申请公布日期 1993.11.19
申请号 JP19920079708 申请日期 1992.04.01
申请人 NEC CORP 发明人 IKA MASAO
分类号 H01L21/82;H01L27/02;H01L27/118 主分类号 H01L21/82
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