| 摘要 |
PURPOSE:To enhance the close contact property of the title wiring board by a method wherein an epoxy-based resin which contains cellulose or its derivative is used as an insulating layer. CONSTITUTION:A multilayer printed wiring board is manufactured by laminating the following sequentially on an insulating board 1: inner-layer circuit patterns 4, 5; insulating layers 6, 7; and outer-layer circuit patterns 15, 16. In this case, an energy-sensitive resin which is composed of an epoxy resin or the like in which cellulose or the like is contained is used for the insulating layers 6, 7. When a prescribed treatment is executed to the surface of the insulating layers 6, 7, the cellulose or the like is dissolved, it displays an anchoring effect to the outer-layer circuit patterns 16, 17 formed on their surface and the close contact property of the multilayer printed wiring board is enhanced. |
