Method of positioning an object on a carrier, device suitable for carrying out this method, and suction tube suitable for use in the device.

摘要

A method and device for laser soldering of an electronic component (7) on a pc-board (1), the component being positioned on a contact face (3) of the pc-board (1) by a device comprising a vibration transducer (53,69,85) which is brought into mechanical hard contact with the component (7) while the component is held against the pc-board. Subsequently, a laser beam (11) heats solder (5) present on the contact face (3) and vibrations generated by the laser beam (11) in the solder (5) are passed on to the vibration transducer (53;69;85) while the mechanical hard contact is being maintained, the vibration transducer (53;69;85) then checking the presence of mechanical contact between the object and the carrier and/or the melting of the solder (5) from a comparatively strong decrease in the vibration amplitude during melting of the solder.