| 摘要 |
<p>A method for forming a dielectric layer in a pattern, comprising the steps: (a) applying to a substrate an unpatterned photohardenable first layer comprising (1) finely divided particles of non-glassy solids and (2) finely divided particles of an inorganic binder having a softening point temperature in the range from 550 to 825C dispersed in a matrix of (3) an organic polymeric binder, (4) a photoinitiating system, (5) a monomer and (6) an organic solvent; (b) applying to the photohardenable first layer a second patterning layer comprising an agent which prevents the transmission of actinic radiation; (c) exposing the photohardenable first layer to actinic radiation to effect photohardening of the photohardenable first layer in those areas not covered by the second patterning layer; (d) removing the second patterning layer and the underlying non-photohardened areas of the first layer; and (e) heating the substrate and the remaining photohardened areas of the first layer from step (d) to a temperature sufficient to effect volatilization of the organic binder, the photoinitiating system, the monomer and the organic solvent, and to effect sintering of the dielectric solids and inorganic binder.</p> |
