发明名称 Method of electrically connecting an integrated circuit to an electric device
摘要 An integrated circuit is mounted on and electrically connected to an electric device with an adhesive therebetween. The adhesive comprises a photo-curable resin and a heat-curable resin. After mounted on the electric device, the integrated circuit is temporarily adhered to the device by exposing the adhesive to a ultraviolet light in order to cure only the photo-curable component of the adhesive. The operation of the electric device connected to the integrated circuit is then tested. If the integrated circuit is faulty, it is replaced. If faultless, the integrated circuit is permanently fixed to the electric device by heating to completely cure the adhesive.
申请公布号 US5261156(A) 申请公布日期 1993.11.16
申请号 US19920841526 申请日期 1992.02.26
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MASE, AKIRA;NEMOTO, HIDEKI;YAMAZAKI, SHUNPEI;TAKEMURA, YASUHIKO
分类号 C03C27/00;H01L21/56;H01L21/60;H01L21/66;H01L23/482;H05K13/04;(IPC1-7):H01R9/09 主分类号 C03C27/00
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