| 摘要 |
A glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na2O, between about 10 and about 25 mole percent K2O, between about 5 and about 15 mole percent Al2O3, between about 35 and about 50 mole percent P2O5 and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe2O3 and between 0 and about 10 mole percent B2O3, has a thermal expansion coefficient in a range of between about 160 and 210x10-7/ DEG C. and a dissolution rate in a range of between about 2x10-7 and 2x10-9 g/cm2-min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.
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