| 摘要 |
<p>A fluorescent display device capable of forming a die bond layer into a desired and uniform thickness, resulting in minimizing adverse affection of thermal stress occurring during the manufacturing and accurately accomplishing wire bonding operation to lead to an improvement in its reliability. Also, a method for manufacturing the device. The fluorescent display device is so constructed that an insulating bank of a frame-like shape is provided between a die bonding pad and bonding pads and a die bond layer is arranged in a space defined at an inside of the bank to adhesively bond an IC chip to a substrate.</p> |
