发明名称 Verfahren zur Vorbereitung einer Unterlage aus einem nichtleitenden Material fuer die Aufnahme von elektrolytisch aufgebrachtem Kupfer
摘要 A non-conductive substrate such as glass, alumina, other ceramics, organic plastics such as "MYLAR" (Trade Mark) is first coated with a mixture of Cu and Al by vapour deposition prior to the electrodeposition of a coating of Cu. The substrate is preferably heated to 200 DEG - 400 DEG C. prior to vapour deposition and the Cu-Al mixture contains 95 - 20% Cu and 5 - 80% Al. The aluminium bronze coating formed has a thickness of 500 - 50,000 </>rA. An electrodeposited coating of Ni-Fe may be formed on the Cu coating.
申请公布号 DE1521006(A1) 申请公布日期 1970.08.20
申请号 DE19661521006 申请日期 1966.03.26
申请人 SPERRY RAND CORP. 发明人 A. ADOMINES,ALFRED
分类号 C23C14/14;C25D5/54;H01B1/00;H01F10/30;H05K3/38 主分类号 C23C14/14
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