发明名称 Hydronic building cooling/heating system
摘要 A temperature control device cools the air in a space bounded by a thermally conductive structure such as a floor structure having embedded coolant pipes. Liquid coolant is provided at a temperature lower than a temperature of the air space, for example using a heat pump to lower the temperature of a coolant in a circulating path or by circulating the coolant through a ground based heat exchanger. Proportionately controllable valves or variably coupled heat exchangers allow regulation of the temperature of the liquid coolant passed through the embedded coolant pipes. A controller such as a microprocessor has outputs coupled to the valves or variable heat exchangers for regulating temperature, and inputs coupled to sensors providing sufficient data to establish the dew point of the air in the room. The controller repetitively establishes the dew point by sensing, for example, air temperature, pressure and relative humidity. The controller adjusts the temperature of the liquid coolant for maintaining the temperature of the thermally conductive structure below the temperature in the room, but at least slightly above the dew point, thereby cooling the room or at least supplementing the output of a forced air cooling system. In this manner the interior air is cooled via heat extraction from the floor without condensation.
申请公布号 US5261251(A) 申请公布日期 1993.11.16
申请号 US19920833955 申请日期 1992.02.11
申请人 UNITED STATES POWER CORPORATION 发明人 GALIYANO, MARK
分类号 F24F5/00;F25B30/06;F25D17/02;G05D23/19;(IPC1-7):F25B49/00 主分类号 F24F5/00
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