| 摘要 |
PURPOSE:To provide a package for electronic component equipped with a multilayer capacitor part having enhanced dielectric strength and mechanical strength. CONSTITUTION:The package for electronic component is equipped with a multilayer capacitor part 22 formed integrally with a part for containing an electronic component. The multilayer capacitor part 22 is provided with a conductive through hole 30 having one end connected with an inner wiring pattern 26 extending from the containing part and penetrating through the multilayer capacitor part 22 in the direction of lamination. The conductive through hole 30 is provided with land patterns 32a, 32b extending on a plane coplanar with a conductive layer 29 while being surrounded by the conductive layer 29 through regions 33a, 33b. The land patterns 32a, 32b are formed such that the regions 33a, 33b, contiguous to each other in the direction of lamination through an insulation layer 28, do not overlap each other. |
