| 摘要 |
<p>PURPOSE:To form a metal-patterned gel by holding a patterned electrode and a counter electrode of platium, etc., firmly to a gel impregnated with a plating soln. and applying a current to the electrodes to conduct plating. CONSTITUTION:A gel 1 is dipped in a metal electroplating soln. 3 and sufficiently impregnated with the soln. 3. A patterned electrodes 5 and a counter electrode 6 of platinum, etc., are firmly held to the plating soln.-impregnated gel 4, and a current is applied to the electrodes to conduct plating. The patterned electrode 5 is released from the gel 4, and the gel is dipped in pure water to remove the plating soln. 3 from the gel. A gel with a metal pattern formed on the surface, especially on the surface having a high content of solvent, is formed in this way.</p> |
