PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT

摘要

PURPOSE:To electrically connect a packaged semiconductor integrated circuit element positively and rigidly with an external electric circuit by bonding external lead terminals rigidly to the wiring conductor of an external electric circuit board. CONSTITUTION:The package for semiconductor element comprises a container 3 for containing a semiconductor integrated circuit element 4 and a plurality of external lead terminal 7 formed through etching and having a surface coated with a solder layer 12, wherein an underlying layer 11 of high melting point metal is formed on the surface of the external lead terminal 7 in order to make the thickness of the solder layer 12 substantially constant.