| 摘要 |
PURPOSE:To provide a package for containing semiconductor element in which malfunction of semiconductor element is retarded even when a plurality of packages are used while being jointed. CONSTITUTION:The package for containing semiconductor element comprises a metal base 2, a metal frame 3 mounted on the metal base 2 and defining a section 9 for containing a semiconductor element 20, and an insulating terminal fixing member 4 for sealing an opening 8 defined by a notched part 2 of the metal frame 3 and the metal base 2. The terminal fixing member 4 is provided with a plurality of metallized strip lines 14 extending inward and outward of the metal frame 3. The metal base 2 is aligned, at an end part thereof, with an end part of the planar part of the terminal fixing member 4 so that voltage standing wave ratio between metallized strip lines 14 will be in the range of 1.3-50GHz when a plurality of packages are arranged and jointed to each other. |
