| 摘要 |
PURPOSE:To obtain a high-quality and low-priced object with little deformation of a wire, in the wire bonding inside a package by making use of metallic wires different in diameter for wire bonding part, inside one package. CONSTITUTION:Metallic wires different in diameter are used as the metallic wires 5-8 for wire bonding, inside one package. Moreover, one manufacture device is provided with a plurality of bonding heads. For example, a gold wire 28mum in diameter is used for an ordinary gold wire 8. And, gold wires larger in diameter than the ordinary gold wire 8 are used for gold wires 5 and 6 connected to the lead frame 2 arranged in the vicinity of the corner 9 of a chip 1 or a long gold wire 7. This way, a high-quality integrated circuit device can be gotten, which has little deformation of a gold wire and a lead wire while reducing the quantity of used high-priced gold wires as far as possible by thickening the diameter of the gold wire at the place easy to deform in view of structure or the place where the long of the gold wire is long, more than other ordinary gold wire. |
