| 摘要 |
PURPOSE:To provide a method of manufacturing a multi-chip semiconductor device which is manufactured in a shorter term, excellent in heat dissipating properties, and able to cope with a tendency that a control semiconductor chip is enhanced in number of pins and size. CONSTITUTION:A lead frame 21 and another lead frame 31 which are thinner than the lead frame 21 and formed of material more easily worked than that of the lead frame 21 are provided, a power chip 6 is mounted on a mounting region 23a of the lead frame 21 and electrically connected to outer leads 24 and 25, and concurrently a control chip 7 is mounted on a mounting region 33a of the lead frame 31 and electrically connected to outer leads 34-39. Therefore, a lead frame formed of material excellent in heat dissipating properties is used for a power chip, and a lead frame formed of material which can be easily worked is used for a control chip, so that a semiconductor device of this design is excellent in heat dissipating properties and able to cope with a tendency that a control semiconductor chip is enhanced in number of pins. |
