| 摘要 |
PURPOSE:To make it possible to attain a printed wiring board which allows high density mounted components to be inspected with ease by discolor- processing at least a surface side of a conducting layer. CONSTITUTION:An identification mark 22 designed to inspect a component mounted state installed between chip component mounting lands 11a and 11b comprises a conducting layer formed simultaneously with a wiring pattern 14 and the surface is discolor-processed with an oxide film 20. During the processing, an oxide film 30 is formed on the surface of the wiring pattern 14 as well. The identification mark 22 is formed in the same process with the wiring process. For example, it consists of a substance which forms the oxide film 20 on the surface of a copper layer 23. Therefore, the color pattern of the oxide film 20 can be clearly identified from a printed wiring 21 through a resist. This construction makes it possible to image-sense regions A and B with a CCD camera and identify the positions of a component 10 after mounted and the mark 22 and inspect the mounting accuracy of the component 10 from a relative positional relation between the chip component 10 and the inspection mark 22. |
