| 摘要 |
PURPOSE:To form precise metal wiring through electroless plating by using an inexpensive device of easy operation. CONSTITUTION:An insulating layer 31 of photosensitive polyimide is deposited on a silicon board, and the surface of the insulating layer is roughened by ashing in a CO2 plasma. Another insulating layer 32 is applied to the roughened surface of the insulating layer 31 and precured. The insulating layer 32 is exposed to UV radiation through a mask with a wiring pattern. The insulating layer 32 is then developed, etched and hardened. Copper is filled in openings 71 in the insulating layer 32 by electroless plating to form metallic layers 42. After washing, the metal deposited on the insulating layers 32 is removed. The surface of the insulating layers 32 is then roughened by ashing, and another wiring is formed on them. |
