| 摘要 |
PURPOSE:To obtain a metal coating laminated board which uses an adhesive sheet for a multi-layer printed wiring board whose epsilongamma or tantheta is low by allowing thermosetting resin to be impregnated with a porous sintered sheet made of superpolymer polyethylene of low epsilon and low tantheta. CONSTITUTION:Multi-layer printed wiring board adhesive sheets 7 form interconnected cell-made multi-layer sheets by sintering UHMWPE particles and hold an adhesive force holding function with impregnated thermosetting resin 2 which is not cured yet. The bubbles contained in the sheets can be eliminated during multi-layer bonding work. The multi-layer printed wiring board before multi-layer bonding, which uses the adhesive sheets 7, comprises a metal coating laminated board 8 and the adhesive sheets 7. If it is necessary to secure mechanical strength, it is combined with a glass cloth reinforcing materials 6 and 6', thereby forming a stronger multi-layer printed board. This construction makes it possible to obtain the multi-layer printed board adhesive sheets and metal coating laminated board which are provided with a thin layer and a large peeling off capacity. |
