| 摘要 |
PURPOSE:To provide a thin and highly reliable semiconductor device sealed with resin. CONSTITUTION:Each semiconductor chip 1 is mounted on each island 2. A pad provided on the semiconductor chip 1 and the first lead 3 or the second lead 4 are connected by bonding wires 6, and this semiconductor device is sealed with mold resin separately for each semiconductor chip. The semiconductor chips 1 are individually sealed with resin, and are wired with each other by the second lead 4. |
