发明名称 |
HIGH BREAKDOWN STRENGTH SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To provide a high breakdown strength semiconductor device which can improve the breakdown strength without being accompanied with the increase of ON voltage. CONSTITUTION:In a high breakdown strength semiconductor device 1, which is equipped with a semiconductor substrate 1 provided with a semiconductor element, and a high breakdown strength construction for the semiconductor element, comprising field plates 12 and 13 and a reverse conductivity type of floating impurity diffusion area 15, the floating impurity diffusion area is made so as to be shallower stepwise as it comes near to the end of each field plate. |
申请公布号 |
JPH05299640(A) |
申请公布日期 |
1993.11.12 |
申请号 |
JP19920101452 |
申请日期 |
1992.04.21 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
MIYAMOTO MASATO;AKIYAMA SHIGEO;HOSOYA KIYOSHI;YAMADA KOICHI |
分类号 |
H01L21/22;H01L29/06;H01L29/74;(IPC1-7):H01L29/74 |
主分类号 |
H01L21/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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