METHOD OF SEALING SEMICONDUCTOR DEVICE WITH RESIN,申请号JP19920209714-传众专利搜索

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发明名称	METHOD OF SEALING SEMICONDUCTOR DEVICE WITH RESIN
摘要
申请公布号	JPH05299451(A)	申请公布日期	1993.11.12
申请号	JP19920209714	申请日期	1992.07.13
申请人	ROHM CO LTD	发明人	HIRAI MINORU
分类号	H01L21/56;H01L23/28;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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