| 摘要 |
PURPOSE:To prevent the deposition of splashing solder during solder flow onto a COB mounting zone by providing a throughhole in the circuit board plate of a loading area of a surface mounting component to be connected by wires and by fitting a protector which covers a conductive pattern the mounting plane into the throughhole. CONSTITUTION:A loading area 3 of an IC chip component on the top face of a circuit board 1 is laid with a die pad 6 and surrounding bonding pads 7. The chip component is loaded on a solder, and the projection 53 of a protector 50 is inserted into a via throughhole 9 at the center of the die 6 in the IC chip loading area 3 to cover this loading area 3. The circuit board 1 is inserted and passed through a reflow furnace in this state. Microsolders splashes out of solder melted at this time: these splashing microsolders drop onto the protection member 54 of the protector 50, but not onto the loading area under it, the component is protected from splashing solder. |
