| 摘要 |
PURPOSE:To simply and automatically inspect the misalignment of a pattern on a printed wiring board by means of a continuity checker. CONSTITUTION:In individual processes such as a pattern formation process for a board main body 10a, a process for making a through hole and a process for filling a conductive paste, a check pattern 11 is formed in a blank part 10b on a board by using the same method as the processes. Said check pattern 11 is composed of the following: a first copper foil part 12 and a second copper foil part 13 which are formed on the surface side of the blank part at a prescribed interval; a third copper foil part 14 which is formed on the rear side in such a way that both ends correspond to the first and second copper foil parts 12, 13 continuously across them; through holes 15a, 15b which are made in positions to be used as the first and second copper foil parts; and a conductive paste 16 which is filled into the through holes. When the continuity or the continuity defect between the first and second copper foil parts 12, 13 is detected by means of a continuity checker, it is possible to inspect whether a misalignment of a circuit pattern or the like exists or not. |
