| 摘要 |
<p>PURPOSE:To manufacture a board for high frequency circuit in which adhesion between a copper foil and dielectric resin is improved, filler can be filled fully in the dielectric resin, and resin molding is facilitated. CONSTITUTION:Two resin immersed reinforcing layers or adhesive films 1, each cut with dimensions slightly larger than those of a product board, are superposed and bonded, at three sides thereof, through an adhesive tape 4 or thermal fusion to produce a bag. plastic powder or a mixture 2 of plastic powder and filler is then placed in the bag which is subsequently bonded, at one open side thereof, through the adhesive tape or thermal fusion. A metal foil 3, e.g. a copper foil, is laminated thereon and sandwiched by metallic mirror plates which are hot pressed to produce a board. More than one bags made of resin immersed reinforcing layer or adhesive film 1 may be superposed or a different type of bag may be employed. Furthermore, thickness of the board can be set arbitrarily by varying the quantity of plastic powder or the mixture of plastic powder and filler to be placed in the bag.</p> |
