发明名称 |
Halbleiteranordnung mit einem Elektrodenfleck. |
摘要 |
In a semiconductor device in which copper or copper alloy bonding wire (16) is bonded to an electrode pad (21) on a semiconductor element (13), the electrode pad (21) is formed of a first metal layer (18) ohmically contacting the semiconductor element, a second metal layer (19) hard enough not to be deformed at wire bonding step, and a third metal layer (20) for bonding a copper wire, to suppress variation in the electric characteristics of a bonding portion and the production of stain in the semiconductor element at wire bonding step. |
申请公布号 |
DE3787709(D1) |
申请公布日期 |
1993.11.11 |
申请号 |
DE19873787709 |
申请日期 |
1987.12.10 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
发明人 |
USUDA, OSAMU C/O PATENT DIVISION, MINATO-KU TOKYO 105, JP |
分类号 |
H01L21/60;H01L21/28;H01L23/485;H01L23/532;H01L29/43 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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