Elektrobeschichtungsverfahren für Photolacke auf gedruckten Schaltungen.

摘要

An electrodeposition coating process of a photoresist for printed circuit board which comprises electrodeposition coating on a conductive surface a photosensitive electrodeposition coating composition (A), and thereafter further electrodeposition coating on the resultant coated plate an electrodeposition coating composition (B) composed chiefly of water-soluble or water-dispersible resin having a glass transition temperature (Tg) not lower than 20 DEG C.