Verfahren zur Herstellung von metallischen Leiterbildern mit Durchmetallisierungen auf einer aus katalysiertem Basismaterial bestehenden,unkaschierten Leiterplatte

摘要

1,261,578. Printed circuits. LICENTIA PATENT VERWALTUNGS G.m.b.H. 2 May, 1969 [4 May, 1968; 10 April, 1969], No. 22600/69. Heading H1R. A printed circuit board having plated through holes is formed by providing on the sides of an insulating base catalytic to the reception of electrolessly deposited copper a non-catalytic protective layer, removing areas of the protective layer corresponding to the required conductor pattern, forming holes through the base, and electrolessly plating the walls of the holes and the exposed surfaces of the catalytic base to form the conductive pattern. A catalytic adhesive layer may be provided between the base and protective layer. Multilayer circuits may be formed.