| 摘要 |
A resilient, fixed-spacing, fixed-orientation mounting of a lens (450) with respect to a semiconductor die (402) having an array of photosensitive elements is established by forming "legs" (454, 456) on the lens and corresponding "landing pads" on the die. The landing pads are preferably formed on the die as "bumps" formed in a tape-automated bonding (TAB) process. The lens is formed as a fresnel lens, to reduce its profile. The lens is grounded to the die, to avoid buildup of static electricity. The photosensitive array is coated with an optically clear coating, to prevent contamination of the photosensitive array on the die. Three lenses which may be integrally molded with one another, and three photosensitive arrays which may be formed on the same die are provided for color imaging. Colored filters for the three lenses are provided and may be integrally formed with the lenses for color imaging. |
