Appts. to eliminate tendency of wafer substrates to swing in semiconductor processing - comprising elastically deformable ring with its inner periphery lying next to source

摘要

Appts. to eliminate the tendency of wafer substrates to swing in machines used to process semiconductor wafers and in which the wafers are processed individually and the substrate is movably stored relative to the source, is claimed. The novelty is that the appts. has an elastically deformable ring with its inner periphery lying next to the source. The ring has two concentrically lying circular disks of different dias., one of which is connected to a rubber-elastic compsn. ADVANTAGE - Process parameters do not have to be changed.