发明名称 Kupfer enthaltendes, nickelfreies Phosphatierverfahren
摘要 A process is disclosed for producing copper-containing, nickel-free phosphate layers with a defined copper content in the phosphate coatings. No pinholing is observed on the metal surface, in particular on electrolytically zinc coated steel, when an appropriate ratio between copper and nitrate is set in the phosphatizing bath.
申请公布号 DE4214992(A1) 申请公布日期 1993.11.11
申请号 DE19924214992 申请日期 1992.05.06
申请人 HENKEL KGAA, 40589 DUESSELDORF, DE 发明人 ROLAND, WOLF-ACHIM, DR., 5650 SOLINGEN, DE;GOTTWALD, KARL-HEINZ, 5042 ERFTSTADT, DE;HAMACHER, MATTHIAS, 5030 HUERTH, DE;BROUWER, JAN-WILLEM, 4044 KAARST, DE;PILAREK, FRANK-OLIVER, 5067 KUERTEN, DE
分类号 C23C22/13;C23C22/18;C23C22/22;C23C22/36;(IPC1-7):C23C22/13;C25D13/20 主分类号 C23C22/13
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