发明名称 |
INTERCONNECTION SYSTEM FOR HIGH PERFORMANCE ELECTRONIC HYBRIDS |
摘要 |
An interconnection system for high performance electronic hybrids employs micro-machined features on a substrate to connect directly to miniature electronic components, such as integrated circuits. The micro-machined features may include posts (109) for connecting to bonding pads of standard components and may also include rails for alignment of components and connections to specially made components. |
申请公布号 |
WO9322795(A1) |
申请公布日期 |
1993.11.11 |
申请号 |
WO1993US03974 |
申请日期 |
1993.04.28 |
申请人 |
MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
发明人 |
HERNDON, TERRY, O.;RAFFEL, JACK, I. |
分类号 |
H01L23/48;H01L23/498;H01L25/18;H05K3/30;H05K3/32;H05K3/40;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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