| 摘要 |
A semiconductor pressure sensor assembly, comprising a receptacle (5) having a floor and including a first cavity (5a) recessed within a first portion of the floor, and a second cavity (8a,8b) recessed within a second portion of the floor and connected to the first cavity at a first junction. A semiconductor pressure sensor (1) is within the first cavity, and a plurality of bonding pads (1a) are disposed about a periphery of a top surface of the pressure sensor chip other than at a location of the first junction, a plurality of external conducting terminals (3) are disposed about a periphery of the receptacle other than at the location of the first junction, and a plurality of wires (4) connect the external conducting terminals to respective ones of the bonding pads. A gelatinous material (7) is within the first and second cavities, and the second cavity serves as a first work region from which an excess of the gelatinous material within the first cavity can be removed. <IMAGE> |
