| 摘要 |
The automatic IC selecting device consists of a dropper (4) at the lower part of test head (10), a selector shuttle (5) moving at the right angle to a selecting rail thereunder, sleeve (6) receiving the tested IC by moving of the selector shuttle on the selecting rail, a sleeve-storing body (8) loading an empty sleeve at one end of selecting rail (2), a sleeve-moving device changing a packed sleeve with an empty sleeve between the selecting rail and sleeve- storing body. The selecting device prevents the lead deformation of IC.
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