| 摘要 |
<p>Improved methods of removing coating films from resin substrates includes first treating the resin substrates in an aqueous alkali solution with a concentration of 0.1 wt % or more at a temperature of 110 DEG C. or more, which temperature is lower than the melting point of the substrates and then polishing the surfaces of the substrates by either bringing them into contact with each other in suitable equipment such as a screw feeder, or using an abrasive in suitable equipment such as a high-speed vessel type stirrer, or subjecting the substrates to a liquid honing process.</p> |
