Wire bonding method

摘要

In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.