| 摘要 |
<p>PURPOSE:To perform the orderly and high-efficient feed of parts, re-divided from a wafer, to a subsequent process without using an expensive image processing device by positioning a wafer laminating, a wafer cutting, and an individual part taking-out process by utilizing a reference portion arranged to a pallet. CONSTITUTION:A wafer is laminated on the first adhesive layer 13 of an adhesive sheet 11 so as to have a given position relation with the reference portions 15a-15d of a pallet 15. The wafer is cut based on the reference portions 15a-15d to produce individual parts 17. Adhesion of the first adhesive layer 13 is lowered by heating, and the individual parts 17 produced by cutting the wafer are taken out from the pallet 15 based on the reference portions 15a and 15d.</p> |
