| 摘要 |
PURPOSE:To facilitate and uniformalize the control of the compsn. and thickness of a plating film by reducing the size of the high-speed solder plating device for electronic parts and simplifying the construction of its pipings. CONSTITUTION:The high-speed solder plating device for electronic parts is constituted to have a plating cell 2, a storage tank 3 which houses this plating cell 2 and receives and stores the plating liquid overflowing from the aperture of the plating cell 2, a circulating pump 8 which circulates and supplies the plating liquid in this storage tank 3 to the plating cell 2 and a liquid flow control board 11 which controls the flow of the plating liquid in the plating cell 2. |
