| 摘要 |
PURPOSE:To eliminate the use of a connection conductor or shorten bonding pads on two opposite sides or two adjacent sides to interconnect devices thereamong or devices and terminals thereamong. CONSTITUTION:There are provided on an oxide film on the surface of a semiconductor device each pair of a power supply bonding pad 23 and a status bonding pad 24 which approach two opposite sides of a chip. Two power supply bonding pads 23 formed on each chip 1 and likewise formed on each chip 1 are partly interconnected through bonding of a conductor wire 4 with external leads 33, 34 in which one ends of lead frames thereof provide a Vcc terminal and an ST terminal respectively. The bonding pads 23, 24 oppositely located inside adjacent chips are interconnected through bonding of the conductor wire 4. Hereby, use of a connection conductor is eliminated or a bonding conductor wire is shortened. |
