发明名称 SEMICONDUCTOR PACKAGE
摘要 PURPOSE:To check the soldering to a printed board easily and reduce the part mounting space by providing a recess at the side face of a base plate. CONSTITUTION:A base plate 3 has a recess 3a at the side face. The base plate 3 is soldered to the land 2 having approximately the same area as the base plate. Accordingly, by the recess 3a, the soldering can be checked easily, and the parts mounting space can be reduced.
申请公布号 JPH05291433(A) 申请公布日期 1993.11.05
申请号 JP19920118301 申请日期 1992.04.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 MATSUMOTO HIDEO;HOSOKAWA YASUNORI;NISHIHARA TATSUTO
分类号 H01L23/12;H01L23/48;H05K1/18;H05K3/34;(IPC1-7):H01L23/12 主分类号 H01L23/12
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