| 摘要 |
<p>PURPOSE:To provide a highly reliable resin sealing-type semiconductor device having small power loss in operation and fit to produce those of large thin types in an automatic and in-line sealing step. CONSTITUTION:A sealing resin sheet 1 has at least one main face made of pre-cured resin and a recessed part on the main face. A manufacturing method includes a step for locating the sealing resin so that the recessed part thereof is put near an active face and situated oppositely to the active face of a semiconductor chip 4, which is connected to a lead, a step for molding the semiconductor chip 4 together in a body with the sealing resin sheet 1 by pushing the sealing resin 1 on the semiconductor chip 4 to cure the pre-cured resin under pressure while a hollow space is formed near the active face of the semiconductor chip 4. Moreover, the manufacturing step includes a recessed part formation step for casting light to the pre-cured resin face in the sealing resin sheet 1, and causing a part bridge through photo-hardening effect to form a recessed part.</p> |
