| 摘要 |
PURPOSE: To deal with the heat produced in used circuits by providing a self-supporting sheet, contg. a mass of diamond or cubic B nitride grains in a matrix and having sections where the concn. of the grains in the matrix does not exceed a specified value in wt. CONSTITUTION: Grains of sections contain diamond or cubic B nitride are of size 2 microns or greater. The grains exist at less than 60wt.% in the sections. The grain content per section is within a range of 10-60wt.%, pref 30-60wt.%. A sheet 10 is composed of three layers 16, 18, 20 which are joined together. The layer 16 is made of a polymer or metal. The layer 18 contains diamond grains in the matrix. The layer 20 is made of an insulation or other material. While being used, the heat produced in an integrated chip passes through the layers 16, 18 and quickly conducts to leave because of the high thermal conductivity diamond grains in this layer. |
