| 摘要 |
PURPOSE:To obtain a board, for high-frequency use, wherein it can be manufactured easily by means of prior art raw materials, installations and techniques, its dielectric constant is low, its coefficient of thermal expansion is small and its cost is low by a method wherein a prepreg whose resin amount is small is used and many very small air bubbles are contained at the inside of the board. CONSTITUTION:A surmount whose basis weight is 58g/m<2> is impregnated with a heat-resistant epoxy resin; a low-resin prepreg whose basis weight is 84g/m<2> (resin amount: 31%) is produced. Sixteen sheets of the low-resin prepreg are piled up; in addition, a copper foil is piled up. This whole assembly is sandwiched between stainless steel sheets; it is heated, pressurized and molded integrally; a board for high-frequency- circuit use is manufactured. Alternatively, a board for high-frequency use is manufactured in the same manner except that a prepreg whose basis weight is 102g/m<2> (resin amount: 44%) is used. When the strength, the surface state and the like of the board are troublesome by laminating only the low-resin prepreg, a prepreg whose resin amount is normal or a prepreg whose base material is dense such as a glass cloth or the like is arranged in one part of the prepreg, or various kinds of bonding sheets or the like can be used in one part on the surface or at the inside. |
