首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
LEAD FRAME AND RESIN-SEALING METHOD FOR SEMICONDUCTOR CHIP USING THE SAME
摘要
申请公布号
JPH05291458(A)
申请公布日期
1993.11.05
申请号
JP19920083888
申请日期
1992.04.06
申请人
SONY CORP
发明人
ITO HITOSHI
分类号
H01L21/56;H01L23/28;H01L23/50;(IPC1-7):H01L23/50
主分类号
H01L21/56
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Garments.
Polymorphs.
THERMOFORMABLE FOAM SHEETING FOR PRODUCING OPEN CONTAINERS
2,3-Dihydrobenzofuran Derivatives
AZEPINE DERIVATIVES, PRODUCTION THEREOF, AND USE THEREOF AS SIGMA-RECEPTOR LIGANDS
Directionally solidified investment casting with improved filling
Nedlasting av brukerprogrammer til en digital dekoder
Device for processing workpieces
Fuel injection system
UNA CINTA DE LAMINADO
PERITONEAL INDUCED MEDICAMENTS
Method for heating a throttle valve body and intake air passage for an internal combustion engine
Plug connection set and seating especially for avionics
METODO PARA CONSERVAR ENERGIA EN UNA UNIDAD REMOTA DE UNA DISPOSICION DE RADIOCOMUNICACIONES Y UNIDAD REMOTA QUE ES OPERABLE EN UN MODO LIBRE PARA ALTERNATIVAMENTE ACTIVARLA Y ENTRAR EN MODO DE REPOSO
A METHOD AND DEVICE FOR PREPARING AND USING DIPHONES FOR MULTILINGUAL TEXT-TO-SPEECH GENERATING
Method for speech coding using linear prediction
Stereoscopic image processing apparatus
Use of an adhesive tape based on a non-woven substrate thermally fixed by melt-blown fibers
COUPLING LATCH
MOIST FABRIC WIPE AND METHOD OF USING IT
