| 摘要 |
PURPOSE:To reduce limitations imposed on the arrangement of a pad disposed on a semiconductor in a semiconductor device to be encapsulated with resin. CONSTITUTION:A part of a leadframe encapsulated in resin 20 is arranged into a double layer structure. A metal section 13 on a first layer and a metal section 14 on a second layer, the metal section 13 and a pad 15, the metal section 14 and the pad 15 are connected with each other by bonding wires 16, 17 and 18, respectively. |
