| 摘要 |
PURPOSE:To obtain a packaging structure which is advantageous for increasing the number of terminals of an LSI chip and speeding it up and can solve reliability problem in a junction which is caused by a difference in thermal expansion from chip carrier substrate. CONSTITUTION:An LSI chip 10 with a small pin-shaped external connection terminal 11 on the entire surface of a circuit is packaged on the surface of a chip carrier substrate 20 with a bump-shaped external connection terminal 22 on the rear surface, thus increasing the number of terminals of the LSI chip or speeding it up, absorbing stress which is caused by a difference in the thermal coefficient of expansion by the pin-shaped external connection terminal, and improving reliability in a junction part. |
