| 摘要 |
<p>PURPOSE:To prevent a lead from being broken in a title device in which film carrier semiconductor devices are laminated by parallely leading an outer lead to a connection portion without deforming the outer lead by employing a lead frame folded into a stepped form. CONSTITUTION:A film carrier tape semiconductor device includes a sprocket, a device hole, a support ring 4, and a lead for inputting/outputting a signal and for applying power supply, all provided on a film made of polyimide and the like. The device further includes an IC chip 3 connected to the device hole, and patting plastic resin 7 is applied thereon for fixing the IC chip 3 and the leads. In a lead frame 6 to which such a semiconductor device 2 is connected, a connection portion 9 of the semiconductor device 2 is folded in a stepped manner in the direction of a signal, and an outer lead 5 of the semiconductor device 2 of each layer is successively connected with the lead frame 6 through pulse heat bonding, and is thereafter molded with molding resin 8.</p> |
