发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To mount and fix a semiconductor device including an integrated circuit region layer without providing an insulating layer on a wiring frame. CONSTITUTION:There are provided a predetermined conductivity type integrated circuit region layer 21, and a support region layer 21, and a support region layer 22 for supporting the integrated circuit region layer 21. The support region layer 22 has a conductivity type complemetary to the integrated circuit region layer 22 The integrated circuit region layer 21 is back-biassed by a bias circuit 29.
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申请公布号 |
JPH05291498(A) |
申请公布日期 |
1993.11.05 |
申请号 |
JP19920087090 |
申请日期 |
1992.04.08 |
申请人 |
TOSHIBA CORP;TOSHIBA MICRO ELECTRON KK |
发明人 |
KOYANAGI MASARU;YAMADA MINORU |
分类号 |
H01L21/52;H01L21/822;H01L27/04;(IPC1-7):H01L27/04 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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