发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To mount and fix a semiconductor device including an integrated circuit region layer without providing an insulating layer on a wiring frame. CONSTITUTION:There are provided a predetermined conductivity type integrated circuit region layer 21, and a support region layer 21, and a support region layer 22 for supporting the integrated circuit region layer 21. The support region layer 22 has a conductivity type complemetary to the integrated circuit region layer 22 The integrated circuit region layer 21 is back-biassed by a bias circuit 29.
申请公布号 JPH05291498(A) 申请公布日期 1993.11.05
申请号 JP19920087090 申请日期 1992.04.08
申请人 TOSHIBA CORP;TOSHIBA MICRO ELECTRON KK 发明人 KOYANAGI MASARU;YAMADA MINORU
分类号 H01L21/52;H01L21/822;H01L27/04;(IPC1-7):H01L27/04 主分类号 H01L21/52
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